Product
Technology
Service
NO. | Variety | 基板Size (mm) |
基板殘邊Size(mm) | Component Dimension (mm) |
Print Accuracy | Placement Accuracy(Cpk≧1) | BGA、CSP (Ball/Pin pitch) |
1 | FPC | L50*W50~L350*W350 | >=5mm | 0603chip~L32*W32*T12 | ±25μm | ±50μm(chip),±50μm(QFP) | >=0.4mm |
2 | PCB | L50*W50~L750*W550 | >=5mm | 0603chip~L100*W90*T25 | ±25μm | ±50μm(chip),±30μm/QFP | >=0.35mm |
3 | Rigid- Flex Board |
L50*W50~L750*W550 | >=5mm | 0603chip~L100*W90*T25 | ±25μm | ±50μm(chip),±30μm/QFP | >=0.35mm |